Mechanical Characterization of Black Diamond (Low-k) Structures for 3D Integrated Circuit and Packaging Applications
نویسنده
چکیده
© 2012 Nagendra Sekhar, licensee InTech. This is an open access chapter distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Mechanical Characterization of Black Diamond (Low-k) Structures for 3D Integrated Circuit and Packaging Applications
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